David M. McComas
Electrical engineering
Hometown: Minneapolis, Minnesota, United States
Graduation date: Spring 2025
Additional details: Honors student
FURI | Fall 2024
Diamond Static Induction Transistors
Ultrawide bandgap (UWBG) semiconductors are predicted by various figures-of-merit to outshine the wide bandgap (WBG) semiconductors such as SiC and GaN in power and radio frequency (RF) electronics. Of the UWBG semiconductors, diamond is highly promising for RF application thanks to the ultra-high breakdown electric field (10 MV/cm), highest thermal conductivity (>2000 W/m-K), and carrier mobility (>2000 cm2/V-s). This project aims to study the performance of diamond Static Induction Transistors (SITs) for RF application and the process for their fabrication. This is done by mapping the device design space in TCAD software Silvaco Atlas experimentally replicating the simulated device structures and characterizing them. Future work should study deviations in device operation under extreme, but application-appropriate, conditions such as radiation, heat, and vibration.
Mentor: Nidhin Kurian Kalarickal
Sponsored project | Fall 2024
David McComas’ FURI project is sponsored by TSMC.
TSMC is a global leader in the semiconductor foundry business. The company’s industry-leading process technologies and portfolio of design enablement solutions help its customers and partners unleash semiconductor innovation. With its recent expansion into Phoenix, TSMC sees the benefit of a strong partnership with ASU faculty and student researchers. TSMC supports the FURI program by providing additional funding for exceptional research projects related to the semiconductor industry. FURI student researchers who pursue a project related to the Semiconductor Manufacturing research theme are eligible for this sponsorship. TSMC-supported FURI students receive a $2,600 stipend and $400 to use for materials. Exceptional research proposals that align with the research theme of Semiconductor Manufacturing will be considered for this additional funding.