William Boutin

Mechanical engineering

Hometown: Merritt Island, Florida, United States

Graduation date: Fall 2024

FURI Semiconductor Research theme icon

FURI | Summer 2024, Needs Review

Flat Punch vs Spherical Indenter Probes for Fracture Testing of GaAs Single Crystals Utilized in Microelectronics and Semiconductor Industries

The increasing demand for microelectronics necessitates standardized materials testing techniques at small length scales. While advancements have been made in material testing at the micro-scale, there are still gaps to be addressed, partly due to the complexities involved, such as specimen manufacturing, indenter probe misalignment, and crack length definition. Accurately characterizing material properties of gallium arsenide (GaAs) and other microelectronic and semiconductor materials using nanoindentation is crucial for advancing damage-tolerant design in the electronics, medical, and transportation industries.


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Additional projects from this student

The inclusion of mode III characterization offers a valuable opportunity to enhance our comprehension of component and system failures.


  • FURI
  • Spring 2024