William Boutin
Mechanical engineering
Hometown: Merritt Island, Florida, United States
Graduation date: Fall 2024
FURI | Spring 2024
Advancing the Semiconductor Industry through the Development of a Miniaturized Reinforced Mixed-Mode Bending Apparatus (MRMMB) with Out-Of-Plane Shear Mode Consideration, Initially Invented at Arizona State University
Mixed modes I/II/III is an important topic in fracture mechanics. Presently, there are several approaches to characterize materials under pure modes I, II, and III. In contrast, a few apparatuses can characterize mixed modes I, II, and III simultaneously. Recently, the Mixed-Mode Bending (MMB) fixture was modified by ASU researchers to the Reinforced Mixed-Mode Bending (RMMB) apparatus to enhance the accuracy of crack energy measurements for mixed modes I and II. Now, the researcher proposes a complementary study to develop the MRMMB fixture for the miniaturized characterization of mixed modes I/II/III to fill the knowledge gaps in fracture mechanics.
Mentor: Masoud Yekani Fard
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Sponsored project | Spring 2024
William Boutin’s FURI project is sponsored by TSMC.
TSMC is a global leader in the semiconductor foundry business. The company’s industry-leading process technologies and portfolio of design enablement solutions help its customers and partners unleash semiconductor innovation. With its recent expansion into Phoenix, TSMC sees the benefit of a strong partnership with ASU faculty and student researchers. TSMC supports the FURI program by providing additional funding for exceptional research projects related to the semiconductor industry. FURI student researchers who pursue a project related to the Semiconductor Manufacturing research theme are eligible for this sponsorship. TSMC-supported FURI students receive a $2,600 stipend and $400 to use for materials. Exceptional research proposals that align with the research theme of Semiconductor Manufacturing will be considered for this additional funding.