FURI | Fall 2025

Single-camera Stereoscopy for Wafer Detection

Defect detection on wafers is one of the quality assurance methods to ensure the high quality of semiconductor manufacturing. Traditional stereoscopic inspection methods typically involve multiple cameras and complex setups, increasing production costs and limiting scalability. This research proposes a scalable single-camera stereoscopy system utilizing programmable illumination to achieve depth perception and in-process defect detection in semiconductor manufacturing. The primary objective is to deliver an affordable, effective approach capable of identifying defects such as micro-cracks, contamination, and structural inconsistencies on semiconductor wafers. To demonstrate, a 3D-printed sample as a test kit would be applied.