FURI | Spring 2026

Investigating the Polyimide-Copper Interface to Improve Modeling and Design in Advanced Semiconductor Packages

This project seeks to investigate the reliability of the polyimide-copper interface commonly found in advanced semiconductor packages. The bond between copper and polyimide is a key point of failure for the reliability of these packaging devices, as they rely on copper redistribution layers to carry input-output data and increasingly, data signals between chips in the same package. Through this research, the characteristics of the interface and the process of delamination can be better understood, enabling more informed decisions when creating packaging designs and helping to improve tools for simulation and lifetime prediction.