William Boutin
Mechanical engineering
Hometown: Merritt Island, Florida, United States
Graduation date: Fall 2024
FURI | Summer 2024
Flat Punch vs Spherical Indenter Probes for Fracture Testing of GaAs Single Crystals Utilized in Microelectronics and Semiconductor Industries
The increasing demand for microelectronics necessitates standardized materials testing techniques at small length scales. While advancements have been made in material testing at the micro-scale, there are still gaps to be addressed, partly due to the complexities involved, such as specimen manufacturing, indenter probe misalignment, and crack length definition. Accurately characterizing material properties of gallium arsenide (GaAs) and other microelectronic and semiconductor materials using nanoindentation is crucial for advancing damage-tolerant design in the electronics, medical, and transportation industries.
Mentor: Masoud Yekani Fard
It’s hip to be square.
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Sponsored project | Summer 2024
William Boutin’s FURI project is sponsored by TSMC.
TSMC is a global leader in the semiconductor foundry business. The company’s industry-leading process technologies and portfolio of design enablement solutions help its customers and partners unleash semiconductor innovation. With its recent expansion into Phoenix, TSMC sees the benefit of a strong partnership with ASU faculty and student researchers. TSMC supports the FURI program by providing additional funding for exceptional research projects related to the semiconductor industry. FURI student researchers who pursue a project related to the Semiconductor Manufacturing research theme are eligible for this sponsorship. TSMC-supported FURI students receive a $2,600 stipend and $400 to use for materials. Exceptional research proposals that align with the research theme of Semiconductor Manufacturing will be considered for this additional funding.