Ryan Flaherty
Mechanical engineering
Hometown: Lakeside, Arizona, United States
Graduation date: Spring 2025
FURI | Fall 2024
3D Printed Auxetic Honeycombs: Investigation of Fatigue Behavior and Interface Characteristics in Fiber-Reinforced Metamaterials
This project characterizes the mechanical properties of a modified Inverse Hexagonal Auxetic Metamaterial (IHAM) through Finite Element Modeling (FEM). The lattice structure was manufactured using Fiber Reinforced Fused Deposition Modeling (FDFRM) with polylactic acid (PLA) as the surrounding thermoplastic and carbon fiber for reinforcement. FEM was performed in ANSYS with compressive displacement loading to characterize both the elastic and hyperelastic performance of the material. Further exploration of the material’s buckling and fatigue characteristics to provide a compreheThis paper characterizes the mechanical properties of a modified Inverse Hexagonal Auxetic Metamaterial (IHAM) through Finite Element Modeling (FEM) and experimental testing. The lattice structure was manufactured using Fiber Reinforced Fused Deposition Modeling (FDFRM) with polylactic acid (PLA) as the surrounding thermoplastic and carbon fiber for reinforcement. FEM was performed in ANSYS with compressive displacement loading to characterize both the elastic and hyperelastic performance of the material. Further investigation will be conducted on the material’s fatigue characteristics to understand its behavior under varied loading conditions.
Mentor: Masoud Yekani Fard
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Sponsored project | Fall 2024
Ryan Flaherty’s FURI project is sponsored by TSMC.
TSMC is a global leader in the semiconductor foundry business. The company’s industry-leading process technologies and portfolio of design enablement solutions help its customers and partners unleash semiconductor innovation. With its recent expansion into Phoenix, TSMC sees the benefit of a strong partnership with ASU faculty and student researchers. TSMC supports the FURI program by providing additional funding for exceptional research projects related to the semiconductor industry. FURI student researchers who pursue a project related to the Semiconductor Manufacturing research theme are eligible for this sponsorship. TSMC-supported FURI students receive a $2,600 stipend and $400 to use for materials. Exceptional research proposals that align with the research theme of Semiconductor Manufacturing will be considered for this additional funding.