FURI | Spring 2026

Quantifying Mechanical Failure in Perovskite Semiconductors Using Shear Testing

Metal halide perovskites are an emerging material for photovoltaic and semiconductor devices, but delamination and mechanical fragility affect their reliability. Mode II fracture energy (GII,c)  is currently understudied, and this study seeks to explore (GII,c) in perovskite thin films deposited on glass substrates to simulate the failure that can occur in real-world conditions from changes in temperature. The machine used is a tensile tester that measures force and displacement until a fracture occurs (failure) by pulling apart on either side of the perovskite. The goal is to better understand mechanical failures and to improve future semiconductor devices.