FURI | Fall 2025

Evaluating UV Ozone vs. Open-Air Plasma Comparisons for Underfill Effectiveness

Underfill materials are essential in semiconductor packaging, as they reinforce mechanical stability and protect solder joints from thermal and mechanical stress. Semiconductor surfaces are typically treated to improve adhesion and activation for reliable underfill bonding. UV ozone is commonly used for this surface activation, but open-air plasma may provide a more scalable and cost-effective alternative. In this study, silicon substrates coated with a tin oxide layer are treated using both methods and evaluated through profilometry, contact angle measurements, and adhesion testing to determine which provides better surface conditioning.