Bill Tran
Mechanical engineering
Hometown: Chandler, Arizona, United States
Graduation date: Spring 2025
Additional details: First-generation college student
Guest Researcher | Spring 2025
Measurements of Microparticle-filled Thermal Interface Materials
This research initiative looks to perform precise thermal conductivity measurements of microparticle-filled composite materials acting as TIMs. Utilizing the American Society for Testing and Materials’ D5470 for measuring conductivity, this project is a steppingstone towards more sophisticated samples that will provide breakthrough thermal management research for semiconductors. This project investigates the effects of surface contact of microparticles and uses copper powder as the main driver for thermal conductivity in polymer composites. The researcher aims to devise accurate methodologies to measure conductivities of polymer composite TIMs, which will then be applied toward complex samples to tackle the heating issues of modern power electronics.
Mentor: Robert Wang
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