Tyler Norkus
Mechanical engineering
Hometown: Las Vegas, Nevada, United States
Graduation date: Spring 2024
FURI | Spring 2024
Finite Element Analysis of Atomic Force Microscopy Measurement of Heterogeneous Nodules Suspended in a Membrane with Application in the Semiconductor, Health, and Security Industries
The semiconductor industry — among others — produces products with nanoscale-level precision, and inclusions and other particles within those products affect their macro- and micro-scale material properties. To improve products, particles and the surrounding material must be examined and analyzed. Atomic force microscopy (AFM) is a powerful technique that has been used to characterize such materials; however, interactions between the AFM indenter and the particles result in complex force-displacement data. The research team uses finite element analysis (FEA) to model AFM performed on particles within a membrane to better understand their material properties and deconvolute structural effects in AFM data.
Mentor: Masoud Yekani Fard
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Sponsored project | Spring 2024
Tyler Norkus’ FURI project is sponsored by TSMC.
TSMC is a global leader in the semiconductor foundry business. The company’s industry-leading process technologies and portfolio of design enablement solutions help its customers and partners unleash semiconductor innovation. With its recent expansion into Phoenix, TSMC sees the benefit of a strong partnership with ASU faculty and student researchers. TSMC supports the FURI program by providing additional funding for exceptional research projects related to the semiconductor industry. FURI student researchers who pursue a project related to the Semiconductor Manufacturing research theme are eligible for this sponsorship. TSMC-supported FURI students receive a $2,600 stipend and $400 to use for materials. Exceptional research proposals that align with the research theme of Semiconductor Manufacturing will be considered for this additional funding.