MORE | Fall 2025

Thermomechanical Reliability Comparison of Flip-chip Packages Using SAC305 Versus Liquid Gallium Solder Joints

Conventional solder alloys such as SAC305 experience plastic deformation and stress buildup during thermal cycling, leading to reliability issues in flip-chip packages. Liquid gallium, with its fluid nature and deformability, offers a potential solution to minimize stress concentration and warpage. This project models the thermomechanical response of both materials in COMSOL Multiphysics under identical temperature loading. Ongoing work focuses on isolating the primary fundamental mechanisms for improved performance and to build a reliable, cost-effective FEM-based comparison framework that predicts solder-induced stress and improves flip-chip reliability in next-generation semiconductor packaging.