MORE | Spring 2024

Thermal Management for 3D Heterogenous Integration of Semiconductor Packaging

The growing demand for advanced computing is undeniable, leading to increased power requirements for computer chips. Consequently, the generated heat from these components is also on the rise. This study focuses on developing an innovative intralayer cooling system for future 3D integrated semiconductor packages. Specifically, a liquid-cooled micro-pin fin heat sink is designed and analyzed to tackle high heat flux and localized hot spots in high-power microsystems. Through numerical simulations and preliminary experimental assessments, the effectiveness of this cooling solution is evaluated. The goal is to gain insights and pave the way for the next generation of microelectronic cooling systems that can efficiently manage thermal challenges in complex and high-performance devices.