FURI | Spring 2025

Open-Air Spray Coating of Ultrathin Aluminum Oxide for Stable Semiconductor Packaging

An ongoing concern for the semiconductor packaging industry is ensuring products are secure against environmental degradation in a cheap and reliable way. One such solution to block water vapor from negatively impacting the performance of these products is to coat semiconductors with a barrier coating, preventing corrosion and reducing thermal degradation. This process is performed with an open-air spray coater, where the product is coated to ensure a uniform layer of aluminum nitrate with a tunable thickness of up to a couple hundred nanometers. After annealing the coating, a dense and scratch-resistant aluminum oxide layer is formed that does not allow for water vapor to affect the surface underneath. This method of application with an open-air spray coater is a cost-effective alternative to what is commonly utilized in industry, allowing for a dependable, yet efficient, final product.