FURI | Summer 2023

Low-Temperature Reduction of Metal Oxide Semiconductors Using Open-Air Plasma

This research proposal focuses on using open-air plasma technology to reduce metal oxidation in semiconductor components that can degrade performance, specifically in printed circuit boards (PCBs). The open-air plasma system utilizes a blown arc discharge to generate reactive species and convective heat, enabling rapid oxide reduction on metal surfaces (i.e., copper, tin, and nickel). Characterization techniques like optical microscopy, X-ray photoelectron spectroscopy, and resistance measurements will evaluate the surface structure, purity, and electrical properties of the foils. The research seeks to optimize the plasma treatment process and assess its impact on semiconductor manufacturing, improving device performance and reliability.