FURI | Spring 2026

Large Scale Production and Customization of Thermal Management Devices for Semiconductor Applications using Continuous Liquid Interface Production

To sustain Moore’s Law, efficient heat dissipation in shrinking semiconductors is vital. While metal additive manufacturing (MAM) offers complex geometries for thermal management, current methods face issues with anisotropy and scalability. We present a layerless metal AM approach using an oxygen dead zone to enable rapid, large-scale production of high-resolution copper and alloy heat sinks. By combining thermal simulations with experimental validation, this research optimizes microscale geometries to maximize surface area and airflow. Our approach provides a cost-effective, customizable solution for superior thermal performance in advanced electronic cooling applications.