FURI | Fall 2018

Failure Analysis of Electrically Conductive Adhesive Interconnects in Photovoltaic Modules

The project investigated the possibility of utilizing ECA (electrically conductive adhesive) to create shingled solar modules with overlapping cell edges. Shingled modules connected by ECA are of interest due to decreased wasted space and potentially higher efficiency. The research team first tested the various ECAs’ adhesive and electrical properties via peel tests and resistivity measurements respectively. Completed shingled test structures then underwent thermocycling testing. Failure methods of the interconnects were determined through x-ray tomography. The research team recommends further damp heat testing to determine how and if the ECA’s will fail under high humidity before advocating industry adopts this technology.