MORE | Spring 2025

Enhancing Thermal Performance in PQFN Packages Using Diamond Heat Spreaders

This research aims to enhance the thermal performance of Power Quad Flat No-Lead (PQFN) packages by integrating diamond heat spreaders. With increasing power densities in modern electronics, thermal hot spots are expected to degrade performance and reliability. Transient thermal simulations will be conducted to evaluate how varying silicon and diamond thicknesses influence heat dissipation. A 3D finite element model will be developed in ANSYS, incorporating material interfaces and thermal resistances. The simulation study anticipates that reducing silicon thickness and introducing a diamond spreader will lower junction temperatures, demonstrating the potential of diamond heat spreaders for high-power semiconductor applications.