FURI | Summer 2025

Enhancing Thermal Management and Reliability in Fan-Out Wafer-Level Packaging

This project aims to identify ways to increase the thermal reliability of Fan-Out Wafer-Level Packaging (FOWLP) of microchips. This would allow for more reliable and efficient microchips that would improve electronics. By creating a realistic model of the package, accurate thermal and structural simulations can be performed. Adding copper or silver through-mold vias (TMVs), acting as vertical thermal conduits, will allow heat to escape directly and efficiently. Comparing the results provides quantified data that illustrates the real benefits of these vias. This data can be used to create more efficient and reliable microchip packages for consumer and commercial applications.