Guest Researcher | Spring 2025

Enhancing Flip Chip Reliability with Gallium Liquid Metal Solder Joints

This research investigates and compares the reliability of flip chip packages using gallium liquid metal. Gallium liquid metal has a low melting temperature and enhanced mechanical compliance, making it an ideal candidate for solder joints in semiconductor packages. The work focuses on warpage analysis and identifying optimized parameters to minimize warpage in flip chip packages making use of gallium liquid metal. By clarifying the thermal and mechanical properties of gallium when used in a solder joint, the researcher’s work aims to advance package reliability and contribute to advancement in microelectronics packaging.