MORE | Spring 2025

Chemical Mechanical Polishing(CMP) of High Thermally Conductive Interlayer Dielectrics (ILDs)

Chemical mechanical polishing (CMP) is essential in semiconductor fabrication to achieve surface uniformity. To improve semiconductor thermal and electric performance, the wafer must have minimal surface irregularities (surface roughness). The CMP process reduces defects and achieves the desired material roughness on the wafer surface. The research focuses on optimizing the CMP process for high thermal conductivity interlayer dielectric material using various slurry compositions and process parameters. The improved process improves heat dissipation and structural integrity in semiconductor devices by reducing surface roughness, so it meets the need for reliable operation in high-performance electronics.