FURI | Spring 2025
Advanced Thermal Analysis of Chiplets Using Machine Learning

With the global increase of computing power comes increased energy consumption. One of the largest components of energy usage comes from thermal inefficiency. The goal of this project is to analyze chiplet design accurately and rapidly using machine learning to be able to optimize semiconductor design decisions. This data-driven optimization addresses sustainability challenges to provide a cleaner future for the semiconductor industry.
Student researcher
John Dyjak
Mechanical engineering
Hometown: Phoenix, Arizona, United States
Graduation date: Spring 2027