FURI | Spring 2021
3D Printed Jet-Based Cooling Heat Exchanger for Electronic Devices
This project explores the potential of a 3D-printed jet-based cooling heat exchanger, also called a 3D-printed jet cooler, to cool electronic devices. Unlike traditional metal-based jet coolers, this 3D printed jet cooler will be fabricated using polymers which considerably reduce the fabrication cost while still offering wide geometric freedom that would offer new designs and possible configurations. The final goal of this research is to find the best parameter set for such devices by manipulating airflow velocity, nozzle diameter, and distance between the nozzle and the heated coil device.
Hometown: Paris, Essonnes, France
Graduation date: Spring 2022